hi-sincerity microelectronics corp. spec. no. : he6411-b issued date : 199.03.06 revised date : 2000.09.01 page no. : 1/3 hsmc product specification HAD826 npn epitaxial planar transistor description the HAD826 is designed for general purpose amplifier and high speed, medium-power switching applications. features ? low collector saturation voltage ? high speed switching absolute maximum ratings ? maximum temperatures storage temperature .......................................................................................... -55 ~ +150 c junction temperature..................................................................................... 150 c maximum ? maximum power dissipations total power dissipation (ta=25 c) .............................................................................. 625 mw ? maximum voltages and currents (ta=25 c) vcbo collector to base voltage ........................................................................................ 75 v vceo collector to emitter voltage..................................................................................... 60 v vebo emitter to base voltage ............................................................................................. 6 v ic collector current ....................................................................................................... 60 0ma characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo 75 - - v ic=10ua, ie=0 bvceo 60 - - v ic=10ma, ib=0 bvebo 6 - - v ie=10ua, ic=0 icbo - - 10 na vcb=60v, ie=0 icex - - 10 na vcb=60v, veb(off)=3v iebo - - 50 na veb=3v, ic=0 *vce(sat)1 - - 300 mv ic=150ma, ib=15ma *vce(sat)2 - - 1 v ic=500ma, ib=50ma *vbe(sat)1 - - 1.2 v ic=150ma, ib=15ma *vbe(sat)2 - - 2 v ic=500ma, ib=50ma *hfe1 35 - - vce=10v, ic=100ua *hfe2 50 - - vce=10v, ic=1ma *hfe3 75 - - vce=10v, ic=10ma *hfe4 100 - 300 vce=10v, ic=150ma *hfe5 40 - - vce=10v, ic=500ma *hfe6 50 - - vce=1v, ic=150ma ft 300 - - mhz ic=20ma, vce=20v, f=100mhz cob - - 8 pf vcb=10v, f=1mhz
hi-sincerity microelectronics corp. spec. no. : he6411-b issued date : 199.03.06 revised date : 2000.09.01 page no. : 2/3 hsmc product specification characteristics curve current gain & colletor current 1 10 100 1000 1 10 100 1000 collector current-ic (ma) current gain-hfe v ce =1v v ce =10v saturation voltage & collector current 1 10 100 1000 10000 0.1 1 10 100 1000 collector current-ic (ma) saturation voltage (mv) v ce(sat) @i c =10i b v be(sat) @i c =10i b cutoff frequency & collector current 1 10 100 1000 1 10 100 collector current-ic (ma) cutoff frequency (mhz) v ce =20v capacitance & reverse-biased voltage 1 10 0.1 1 10 100 reverse biased voltage (v) capacitance-(pf) cob safe operating area 1 10 100 1000 10000 1 10 100 forward voltage-vce (v) collector current-ic (ma) pt=1s pt=100ms pt=1ms pd-ta 0 100 200 300 400 500 600 700 0 20 40 60 80 100 120 140 160 ambient temperature-ta( o c) power dissipation-pd(mw)
hi-sincerity microelectronics corp. spec. no. : he6411-b issued date : 199.03.06 revised date : 2000.09.01 page no. : 3/3 hsmc product specification to-92 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - *0.1000 - *2.54 c 0.5000 - 12.70 - i - *0.0500 - *1.27 d 0.0142 0.0220 0.36 0.56 1 - *5 - *5 e - *0.0500 - *1.27 2 - *2 - *2 f 0.1323 0.1480 3.36 3.76 3 - *2 - *2 notes : 1.dimension and tolerance based on our spec. dated apr. 25,1996. 2.controlling dimension : millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material : ? lead : 42 alloy ; solder plating ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory : ? head office (hi-sincerity microelectronics corp.) : 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel : 886-2-25212056 fax : 886-2-25632712, 25368454 ? factory 1 : no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel : 886-3-5983621~5 fax : 886-3-5982931 ? factory 2 : no. 17-1, ta-tung rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel : 886-3-5977061 fax : 886-3-5979220 3 1 a d b c i 1 e f 2 3 g h 2 style : pin 1.base 2.collector 3.emitter 3-lead to-92 plastic package hsmc packa g e code : a marking : hsmc logo part number date code product series rank laser mark hsmc logo part number product series ink mark
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